Wafer Cutting Machine
- It is a machine used to cut cream-coated and cooled wafer blocks with steel blades in order to bring them to final product dimensions.
- Cutting dimensions can be adjusted according to desired dimensions.
- The production process continues uninterruptedly thanks to the automatic feeding system.
- It can cut in single or multiple blocks.
- It is possible to make bi-directional cutting in two different sizes.
- It can be easily controlled from the touch panel on the machine.